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| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Packaging | Bulk |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Published | 2016 |
| Technology | CMOS |
| Factory Lead Time | 11 Weeks |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| HTS Code | 8542.31.00.01 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Operating Temperature | -40°C~100°C TJ |
| Number of I/O | 180 |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Supply Voltage | 0.85V |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Peripherals | DMA, WDT |
| Number of Terminations | 625 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Core Processor | Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? |
| Series | Zynq? UltraScale+? MPSoC CG |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq?UltraScale+? FPGA, 154K+ Logic Cells |
| Supply Voltage-Max (Vsup) | 0.876V |
| Supply Voltage-Min (Vsup) | 0.825V |
| JESD-30 Code | R-PBGA-B625 |
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