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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Packaging | Tray |
| Min Operating Temperature | -40°C |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2009 |
| Factory Lead Time | 11 Weeks |
| Max Operating Temperature | 100°C |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Operating Temperature | -40°C~100°C TJ |
| Number of I/O | 130 |
| Frequency | 800MHz |
| Speed | 800MHz |
| Max Frequency | 800MHz |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Memory Type | ROMless |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of Pins | 485 |
| Primary Attributes | Kintex?-7 FPGA, 125K Logic Cells |
| Package / Case | 484-FBGA, FCBGA |
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