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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Technology | CMOS |
| Factory Lead Time | 11 Weeks |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Terminal Form | BALL |
| Number of I/O | 128 |
| HTS Code | 8542.31.00.01 |
| Height Seated (Max) | 3.43mm |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Operating Temperature | -40°C~100°C TJ |
| Length | 21mm |
| Width | 21mm |
| Supply Voltage | 0.85V |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Peripherals | DMA, WDT |
| Number of Terminations | 625 |
| Core Processor | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 |
| Series | Zynq? UltraScale+? MPSoC EG |
| RAM Size | 1.2MB |
| Speed | 500MHz, 1.2GHz |
| Package / Case | 625-BFBGA, FCBGA |
| Primary Attributes | Zynq?UltraScale+? FPGA, 103K+ Logic Cells |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| JESD-30 Code | S-PBGA-B625 |
| Architecture | MPU, FPGA |
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