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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Memory Width | 1 |
| Surface Mount | YES |
| Number of Terminations | 8 |
| Factory Lead Time | 8 Weeks |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Published | 2014 |
| Supply Voltage | 1.8V |
| Programming Voltage | 1.8V |
| Operating Temperature | -40°C~85°C TA |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Interface | SPI |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Parallel/Serial | SERIAL |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Min (Vsup) | 1.65V |
| Supply Voltage-Max (Vsup) | 1.95V |
| Memory Interface | SPI – Quad I/O |
| Clock Frequency | 104MHz |
| Memory Size | 4Mb 512K x 8 |
| Memory Density | 4194304 bit |
| Voltage – Supply | 1.65V~1.95V |
| Write Cycle Time – Word, Page | 1.5ms |
| Screening Level | ISO/TS-16949 |
| Organization | 4MX1 |
| Series | SST26 SQI? |
| JESD-30 Code | R-PBGA-B8 |
| Package / Case | 8-UFBGA, CSPBGA |
| Base Part Number | SST26WF040 |
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