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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Packaging | Bulk |
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Part Status | Obsolete |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Alternate Memory Width | 8 |
| Operating Temperature (Min) | -40°C |
| JESD-609 Code | e0 |
| Memory Width | 16 |
| Technology | CMOS |
| Operating Temperature (Max) | 85°C |
| Supply Voltage | 3V |
| Programming Voltage | 3V |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Moisture Sensitivity Level (MSL) | Vendor Undefined |
| Reach Compliance Code | compliant |
| Terminal Pitch | 1mm |
| Memory IC Type | FLASH |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Number of Terminations | 64 |
| Supply Voltage-Min (Vsup) | 2.7V |
| Terminal Form | BALL |
| Height Seated (Max) | 1.4mm |
| Width | 11mm |
| Length | 13mm |
| Parallel/Serial | PARALLEL |
| Operating Mode | ASYNCHRONOUS |
| Access Time (Max) | 110 ns |
| Memory Density | 268435456 bit |
| Organization | 16MX16 |
| JESD-30 Code | R-PBGA-B64 |
*The following components have specifications similar
*The following five components have specifications similar
