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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Number of Functions | 1 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Operating Temperature (Min) | -40°C |
| Memory Width | 16 |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 3V |
| Factory Lead Time | 13 Weeks |
| Operating Temperature (Max) | 105°C |
| Terminal Pitch | 1mm |
| Memory IC Type | FLASH |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Number of Terminations | 64 |
| Supply Voltage-Min (Vsup) | 2.7V |
| Programming Voltage | 2.7V |
| Terminal Form | BALL |
| Height Seated (Max) | 1.4mm |
| Length | 9mm |
| Width | 9mm |
| Screening Level | AEC-Q100 |
| Parallel/Serial | PARALLEL |
| Operating Mode | ASYNCHRONOUS |
| HTS Code | 8542.32.00.51 |
| Access Time (Max) | 110 ns |
| Memory Density | 1073741824 bit |
| Organization | 64MX16 |
| JESD-30 Code | S-PBGA-B64 |
| Additional Feature | CAN ALSO ORGANISED AS 1GX1 |
*The following components have specifications similar
*The following five components have specifications similar
