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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Alternate Memory Width | 2 |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Surface Mount | YES |
| Memory Width | 4 |
| Moisture Sensitivity Level (MSL) | 3 |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Supply Voltage | 3V |
| Number of Terminations | 12 |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Part Status | Not For New Designs |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Published | 2017 |
| Supply Voltage-Min (Vsup) | 2.7V |
| Programming Voltage | 2.7V |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Voltage – Supply | 2.7V~3.6V |
| Parallel/Serial | SERIAL |
| Operating Mode | SYNCHRONOUS |
| Technology | FLASH – NOR |
| Terminal Finish | TIN SILVER COPPER |
| Clock Frequency | 104MHz |
| Memory Density | 67108864 bit |
| Memory Size | 64Mb 8M x 8 |
| Write Cycle Time – Word, Page | 50μs, 3ms |
| Series | MXSMIO? |
| Organization | 16MX4 |
| Package / Case | 12-UFBGA, WLCSP |
| JESD-30 Code | R-PBGA-B12 |
| Height Seated (Max) | 0.52mm |
| Additional Feature | ALSO CONFIGURABLE AS 64M X 1 |
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