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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Toggle Bit | NO |
| Data Polling | NO |
| RoHS Status | ROHS3 Compliant |
| Packaging | Bulk |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Command User Interface | YES |
| Ready/Busy | YES |
| Factory Lead Time | 3 Weeks |
| Part Status | Obsolete |
| Memory Width | 16 |
| Peak Reflow Temperature (Cel) | 260 |
| Published | 2011 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Height Seated (Max) | 1mm |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| Nominal Supply Current | 20mA |
| JESD-609 Code | e1 |
| Operating Temperature | 0°C~70°C TA |
| Memory Type | Non-Volatile |
| Length | 11mm |
| Supply Voltage-Min (Vsup) | 1.7V |
| Contact Plating | Copper, Silver, Tin |
| Word Size | 16b |
| Sync/Async | Asynchronous |
| Access Time | 25 ns |
| Number of Terminations | 63 |
| Number of Pins | 63 |
| Terminal Finish | TIN SILVER COPPER |
| Supply Voltage-Max (Vsup) | 1.95V |
| Technology | FLASH – NAND |
| Page Size | 2kB |
| Voltage – Supply | 1.7V~1.95V |
| Standby Current-Max | 0.00005A |
| Address Bus Width | 1b |
| Sector Size | 64K |
| Package / Case | 63-VFBGA |
| Number of Sectors/Size | 4K |
| Memory Size | 4Gb 256M x 16 |
| Density | 4 Gb |
| Organization | 256MX16 |
| Base Part Number | MT29F4G16 |
*The following components have specifications similar
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