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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Surface Mount | YES |
| Memory Width | 8 |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 1.8V |
| Factory Lead Time | 11 Weeks |
| Operating Temperature | -40°C~85°C TA |
| Reach Compliance Code | compliant |
| Height Seated (Max) | 1mm |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Memory Type | Non-Volatile |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Supply Voltage-Min (Vsup) | 1.7V |
| Length | 13mm |
| Operating Mode | SYNCHRONOUS |
| Width | 10.5mm |
| Supply Voltage-Max (Vsup) | 1.95V |
| HTS Code | 8542.32.00.71 |
| Voltage – Supply | 1.7V~1.95V |
| Memory Density | 4294967296 bit |
| Memory Format | FLASH, RAM |
| Organization | 512MX8 |
| Number of Terminations | 137 |
| Technology | FLASH – NAND, Mobile LPDRAM |
| Clock Frequency | 208MHz |
| Package / Case | 137-VFBGA |
| JESD-30 Code | R-PBGA-B137 |
| Memory Size | 4Gb 512M x 8 N 2G 64M x 32 LPDRAM |
| Additional Feature | IT IS ALSO HAVING 2GBIT (X 32) LPDDR |
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