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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Surface Mount | YES |
| Part Status | Obsolete |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage-Max (Vsup) | 3.3V |
| Qualification Status | Not Qualified |
| Memory Width | 16 |
| Technology | CMOS |
| Reach Compliance Code | unknown |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 3V |
| Power Supplies | 3V |
| Operating Temperature | -40°C~85°C TA |
| Memory Format | FLASH |
| Terminal Position | BOTTOM |
| Supply Voltage-Min (Vsup) | 2.7V |
| Terminal Pitch | 0.8mm |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Height Seated (Max) | 1.4mm |
| Memory Type | Non-Volatile |
| Number of Pins | 66 |
| Number of Terminations | 66 |
| Pin Count | 66 |
| Length | 12mm |
| Data Bus Width | 16b |
| Operating Mode | ASYNCHRONOUS |
| Supply Current-Max | 0.02mA |
| HTS Code | 8542.32.00.71 |
| Voltage – Supply | 2.7V~3.3V |
| Access Time (Max) | 85 ns |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| Memory Density | 33554432 bit |
| Organization | 2MX16 |
| Subcategory | Other Memory ICs |
| Write Cycle Time – Word, Page | 85ns |
| Memory Size | 32Mb 2M x 16 |
| Package / Case | 66-LFBGA |
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