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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | RoHS Compliant |
| Radiation Hardening | No |
| Packaging | Tray |
| Max Operating Temperature | 85°C |
| Factory Lead Time | 4 Weeks |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2009 |
| Min Operating Temperature | 0°C |
| Operating Supply Voltage | 1.2V |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Core Architecture | ARM |
| Operating Temperature | 0°C~85°C TJ |
| Frequency | 166MHz |
| Speed | 166MHz |
| RAM Size | 64kB |
| Core Processor | ARM? Cortex?-M3 |
| Length | 31mm |
| Width | 31mm |
| Architecture | MCU, FPGA |
| Min Supply Voltage | 1.14V |
| Max Supply Voltage | 1.26V |
| Flash Size | 256KB |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Series | SmartFusion?2 |
| Peripherals | DDR, PCIe, SERDES |
| Number of Pins | 896 |
| Package / Case | 896-BGA |
| Number of I/O | 377 |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of Logic Elements/Cells | 56340 |
| Primary Attributes | FPGA – 50K Logic Modules |
| Supplier Device Package | 896-FBGA (31×31) |
| Base Part Number | M2S050 |
| Number of Logic Blocks (LABs) | 4695 |
| Memory Size | 164.3kB |
*The following components have specifications similar
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