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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Temperature Grade | COMMERCIAL |
| Qualification Status | Not Qualified |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 70°C |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Supply Voltage | 1.8V |
| Published | 2006 |
| Terminal Pitch | 1mm |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Length | 25mm |
| Width | 25mm |
| Supply Voltage-Min (Vsup) | 1.7V |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Max (Vsup) | 1.9V |
| HTS Code | 8542.32.00.41 |
| ECCN Code | 3A991.B.2.A |
| Package / Case | FCBGA |
| Number of Terminations | 576 |
| Pin Count | 576 |
| Height Seated (Max) | 2.55mm |
| Memory Density | 18874368 bit |
| Access Time (Max) | 0.45 ns |
| Organization | 1MX18 |
| Frequency | 233MHz |
| Memory Type | QDR, RAM, SRAM |
| JESD-30 Code | S-PBGA-B576 |
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