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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Functions | 1 |
| Memory Width | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| Lead Free | Lead Free |
| JESD-609 Code | e4 |
| Terminal Position | DUAL |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Min Operating Temperature | -40°C |
| Number of Pins | 16 |
| Number of Terminations | 16 |
| Pin Count | 16 |
| Terminal Form | GULL WING |
| Technology | CMOS |
| Factory Lead Time | 16 Weeks |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 85°C |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Published | 2014 |
| Terminal Pitch | 1.27mm |
| Memory Type | FLASH |
| Temperature Grade | INDUSTRIAL |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.7V |
| Width | 7.5mm |
| Frequency (Max) | 50MHz |
| Package / Case | SOIC |
| Height Seated (Max) | 2.65mm |
| Parallel/Serial | SERIAL |
| Operating Supply Current | 100μA |
| Length | 10.3mm |
| Write Cycle Time-Max (tWC) | 8ms |
| Memory Density | 67108864 bit |
| Weight | 665.986997mg |
| Memory Size | 8MB |
| Organization | 64MX1 |
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