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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Packaging | Bulk |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| ECCN Code | EAR99 |
| Factory Lead Time | 12 Weeks |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Published | 2008 |
| Memory Width | 32 |
| Height Seated (Max) | 1mm |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Part Status | Last Time Buy |
| Memory Interface | Parallel |
| JESD-609 Code | e1 |
| Supply Voltage | 1.2V |
| Operating Supply Voltage | 1.2V |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Memory Type | Volatile |
| Contact Plating | Copper, Silver, Tin |
| Data Bus Width | 32b |
| Supply Voltage-Max (Vsup) | 1.3V |
| Operating Mode | SYNCHRONOUS |
| Memory Format | DRAM |
| Length | 11.5mm |
| Supply Voltage-Min (Vsup) | 1.14V |
| Operating Temperature | -40°C~85°C TC |
| Number of Terminations | 134 |
| Number of Pins | 134 |
| Max Frequency | 533MHz |
| Address Bus Width | 13b |
| Voltage – Supply | 1.14V~1.95V |
| Density | 1 Gb |
| Technology | SDRAM – Mobile LPDDR2 |
| Access Mode | SINGLE BANK PAGE BURST |
| Package / Case | 134-VFBGA |
| Memory Size | 1Gb 32M x 32 |
| Additional Feature | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM |
| Organization | 32MX32 |
*The following components have specifications similar
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