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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Surface Mount |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of Terminations | 8 |
| Pin Count | 8 |
| Terminal Position | DUAL |
| Factory Lead Time | 6 Weeks |
| Packaging | Tube |
| Qualification Status | Not Qualified |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Finish | Matte Tin (Sn) |
| Published | 2010 |
| Terminal Pitch | 1.27mm |
| Operating Temperature | -40°C~85°C TA |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Width | 3.9mm |
| Height Seated (Max) | 1.75mm |
| Length | 4.9mm |
| Memory Type | Non-Volatile |
| Voltage – Supply | 2.7V~5.5V |
| Memory Interface | I2C |
| HTS Code | 8542.31.00.01 |
| JESD-30 Code | R-PDSO-G8 |
| Power Supplies | 3/5V |
| Memory Format | EEPROM |
| Clock Frequency | 400kHz |
| Supply Current-Max | 0.5mA |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Subcategory | Other Microprocessor ICs |
| Memory Size | 896b 112 x 8 |
| Base Part Number | DS2460 |
*The following components have specifications similar
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