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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Through Hole |
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Packaging | Tray |
| JESD-609 Code | e0 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 1.8V |
| REACH SVHC | Unknown |
| Terminal Pitch | 1.27mm |
| Factory Lead Time | 20 Weeks |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Memory Interface | Parallel |
| Published | 2003 |
| Terminal Finish | TIN LEAD |
| Memory Type | Volatile |
| Length | 25mm |
| Max Frequency | 250MHz |
| Memory Format | SRAM |
| Supply Voltage-Min (Vsup) | 1.7V |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage-Max (Vsup) | 1.9V |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Voltage – Supply | 1.7V~1.9V |
| Operating Temperature | -55°C~125°C TA |
| Width | 21mm |
| HTS Code | 8542.32.00.41 |
| Additional Feature | PIPELINED ARCHITECTURE |
| ECCN Code | 3A001.A.2.C |
| Memory Size | 72Mb 4M x 18 |
| Technology | SRAM – Synchronous, QDR II+ |
| Height Seated (Max) | 5.38mm |
| Organization | 4MX18 |
| Memory Density | 75497472 bit |
| Total Dose | 300k Rad(Si) V |
| Package / Case | 165-BFCCGA |
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