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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| DMA Channels | NO |
| DAC Channels | NO |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Surface Mount | YES |
| Has ADC | YES |
| PWM Channels | YES |
| JESD-609 Code | e3 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| On Chip Program ROM Width | 8 |
| Supply Voltage | 3.3V |
| Packaging | Tray |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 1.8V |
| Terminal Finish | Tin (Sn) |
| Bit Size | 32 |
| Operating Temperature | -40°C~85°C TA |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Program Memory Type | FLASH |
| Number of Terminations | 48 |
| Terminal Form | NO LEAD |
| Oscillator Type | Internal |
| Length | 7mm |
| Width | 7mm |
| Number of I/O | 37 |
| Factory Lead Time | 21 Weeks |
| Speed | 20MHz |
| Clock Frequency | 20MHz |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Core Size | 32-Bit |
| Height Seated (Max) | 0.9mm |
| RAM Size | 8K x 8 |
| Voltage – Supply (Vcc/Vdd) | 1.8V~5.5V |
| Core Processor | ARM? Cortex?-M3 |
| Program Memory Size | 64KB 64K x 8 |
| Peripherals | LVD, POR, PWM, WDT |
| RAM (bytes) | 8192 |
| Package / Case | 48-VFQFN Exposed Pad |
| ROM (words) | 65536 |
| JESD-30 Code | S-XQCC-N48 |
| Data Converter | A/D 6x12b |
| Connectivity | CSIO, I2C, UART/USART |
| Series | FM3 MB9A130LB |
*The following components have specifications similar
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