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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Terminations | 8 |
| Memory Width | 16 |
| Technology | CMOS |
| Supply Voltage | 2.5V |
| Published | 2014 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Terminal Position | BOTTOM |
| Operating Temperature | 0°C~70°C TA |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Serial Bus Type | SPI |
| JESD-609 Code | e2 |
| Memory Format | EEPROM |
| Factory Lead Time | 25 Weeks |
| Interface | SPI, Serial |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Min (Vsup) | 1.6V |
| Write Cycle Time – Word, Page | 10ms |
| Write Cycle Time-Max (tWC) | 10ms |
| Contact Plating | Silver, Tin |
| Clock Frequency | 5MHz |
| Access Time | 75 ns |
| Terminal Finish | Tin/Silver (Sn/Ag) |
| Voltage – Supply | 1.6V~3.6V |
| Memory Size | 2Mb 256K x 8 |
| Organization | 256KX16 |
| Density | 2 Mb |
| Length | 3.12mm |
| Width | 2.04mm |
| JESD-30 Code | R-PBGA-B8 |
| Package / Case | 8-XFBGA, WLCSP |
| Height Seated (Max) | 0.37mm |
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