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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Number of Functions | 1 |
| Memory Width | 1 |
| Surface Mount | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Technology | CMOS |
| Memory Format | FLASH |
| Supply Voltage-Max (Vsup) | 3.6V |
| Number of Terminations | 11 |
| Terminal Position | BOTTOM |
| Programming Voltage | 2.7V |
| JESD-609 Code | e1 |
| Factory Lead Time | 22 Weeks |
| Published | 1997 |
| Memory Type | Non-Volatile |
| Memory Interface | SPI |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Parallel/Serial | SERIAL |
| Supply Voltage-Min (Vsup) | 2.3V |
| Operating Mode | SYNCHRONOUS |
| Voltage – Supply | 2.3V~3.6V |
| Operating Temperature | -40°C~85°C TC |
| Clock Frequency | 85MHz |
| Memory Density | 16777216 bit |
| Organization | 16MX1 |
| Write Cycle Time – Word, Page | 8μs, 4ms |
| Memory Size | 16Mb 528Bytes x 4096 pages |
| Height Seated (Max) | 0.52mm |
| Package / Case | 11-UFBGA, WLCSP |
| Width | 2.085mm |
| Length | 3.265mm |
| JESD-30 Code | R-PBGA-B11 |
*The following components have specifications similar
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