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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION | 
|---|---|
| Part Status | Active | 
| Radiation Hardening | No | 
| RoHS Status | Non-RoHS Compliant | 
| Number of Logic Blocks (LABs) | 8 | 
| Factory Lead Time | 12 Weeks | 
| Packaging | Tray | 
| Max Operating Temperature | 85°C | 
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 
| Published | 2009 | 
| Min Operating Temperature | 0°C | 
| Frequency | 100MHz | 
| Speed | 100MHz | 
| Operating Supply Current | 1mA | 
| Core Architecture | ARM | 
| Operating Temperature | 0°C~85°C TJ | 
| Number of Pins | 484 | 
| RAM Size | 64kB | 
| Max Frequency | 120MHz | 
| Core Processor | ARM? Cortex?-M3 | 
| Architecture | MCU, FPGA | 
| Peripherals | DMA, POR, WDT | 
| Flash Size | 256KB | 
| Package / Case | 484-BGA | 
| Supplier Device Package | 484-FPBGA (23×23) | 
| Number of Gates | 200000 | 
| Series | SmartFusion? | 
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 
| Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 
| Base Part Number | A2F200 | 
| Primary Attributes | ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops | 
| Number of I/O | MCU – 41, FPGA – 94 | 
*The following components have specifications similar
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