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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Ports | 2 |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Published | 2013 |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 70°C |
| Packaging | Tape & Reel |
| Factory Lead Time | 7 Weeks |
| Lead Pitch | 1mm |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Thickness | 1.4mm |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Frequency | 200MHz |
| Frequency (Max) | 200MHz |
| Number of Terminations | 256 |
| Number of Pins | 256 |
| Pin Count | 256 |
| Length | 17mm |
| Width | 17mm |
| Access Time | 15 ns |
| Min Supply Voltage | 3.15V |
| Package / Case | BGA |
| Address Bus Width | 36b |
| Max Supply Voltage | 3.45V |
| Memory Type | RAM, SDR, SRAM |
| Density | 9 Mb |
| Memory Size | 1.1MB |
| Additional Feature | PIPELINED OR FLOW THROUGH ARCHITECTURE |
*The following components have specifications similar
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