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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Ports | 2 |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| Lead Free | Lead Free |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 70°C |
| Packaging | Tape & Reel |
| Supply Voltage | 1.8V |
| Operating Supply Voltage | 1.8V |
| Published | 2009 |
| Terminal Pitch | 1mm |
| Part Status | Discontinued |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Thickness | 1.4mm |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Frequency | 200MHz |
| Height Seated (Max) | 1.5mm |
| Number of Terminations | 256 |
| Number of Pins | 256 |
| Pin Count | 256 |
| Supply Voltage-Min (Vsup) | 1.7V |
| Length | 17mm |
| Width | 17mm |
| Access Time (Max) | 10 ns |
| Supply Voltage-Max (Vsup) | 1.9V |
| Address Bus Width | 18b |
| Memory Type | RAM, SRAM |
| Density | 9 Mb |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
*The following components have specifications similar
*The following five components have specifications similar
